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IC and Modules Application

1Function application

Supports highly integrated or small-sized IC and modules, such as PA, SIP packaging, etc.

2Product Features

Related Product Series

Multilayer Ceramic Chip Capacitors for General Use (C series)

High-Q Multilayer Ceramic Chip Capacitors (C Series -HQC)

High-Q Multilayer Ceramic Chip Capacitors (U Series)

C series Product Features

The mainstream packaging size is ultra-miniature size such as 01005 (0.4*0.2mm), 008004 (0.25*0.125mm), which meets the market trend of miniaturization and high integration, and reduces the loop impedance of peripheral circuits

Typical Specifications of C Series





C Series -HQC & U Series Product Features

It can effectively improve the signal transmission efficiency of radio frequency circuits, reduce reflection loss, and enhance processing capabilities

Typical Specifications of C Series-HQC & U Series

01005-High Q-C0G-0.5pF-±0.1pF-25V

01005-High Q-C0G - 3.3pF-±0.05pF-25V

0201-High Q-C0G - 4.7pF-±0.1pF-25V

0201-High Q-C0G - 10pF-±2%-25V

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